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| ZMD-Standard December 2004 Package TSOP32 (I/8x20) (Normal Option) MDS 751 Dimensions in millimetres Based on JEDEC: JEP95 MO-142 1 Dimensions Z A2 Detail Z 0,1 32 1 A A1 0,1 M e D HD Dimensions of Sub-Group B1 Amax bPmin bPmax enom HDmin HDmax LPmin 1,20 0,17 0,27 0,50 19,80 20,20 0,40 bp Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* 0,05 0,15 0,90 1,05 0,10 0,21 18,30 18,50 7,80 8,20 0 5 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends Dmax* Emin* Emax* min max * without mold-flash Zentrum Mikroelektronik Dresden Editor: signature by Schoder Check: signature by Marx Date: 07.12.2004 Quality: signature by Tina Kochan Doc-No. QS-000751-HD-02 E c LP |
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